The earliest organosilicon glass resin and high temperature mica binder in China are Huo Changshun, Chen Rufeng and others of Chengguang Institute of Chemical Engineering, Ministry of Chemical Industry. In the late 1970s, CTS-103 organosilicon resin, commonly known as organosilicon glass resin, was successfully prepared by hydrolytic polycondensation of methyltriethoxysilane in the presence of acid catalyst. The resin was used for the treatment of high-grade paper and the coating protection of metal surface in the early stage. It can also be used for the bonding of mica sheets or mica powder. In 1980, Shanghai Resin Factory Fang Sanhua, Xue Zhiqing and Li Yansheng used solid cation exchange resins as temporary acid catalysts. Fang Sanhua used methyl triethoxysilane, Xue Zhiqing and Li Yansheng used methyl triethoxysilane as the main additive and a small amount of dimethyl diethoxysilane to synthesize transparent and wear-resistant SAR-1 and SAR-2 silicone resins, respectively. Because of the absence of residual inorganic acid, the storage property of the resin is very stable and no cementation is found after one year. Due to the introduction of a small amount of binary functional raw materials, SAR-2 products are hard, medium and soft, and have a wider range of applications. It can be widely used in glass, plastics, metals and other materials, especially for the protection of transparent plastics such as polycarbonate, polystyrene and polyvinyl chloride, as well as for the moisture-proof and insulation protection coating of electronic components, which will soon form large-scale production.