In the production and processing of electronic products, the potting process is often used.


The so-called potting is the process of filling liquid gels into devices containing electronic components and circuits mechanically or manually. Under normal temperature or heating conditions, these gels solidify into thermosetting polymer elastomers with excellent performance. It plays the role of waterproof, moisture-proof, dust-proof, insulation, heat conduction, confidentiality, anti-corrosion, temperature resistance and shock resistance. These glues for electronic components and circuit potting are called electronic potting compounds.




According to chemical composition classification, the current mainstream electronic encapsulants are mainly epoxy resin encapsulants, polyurethane electronic encapsulants and silicone electronic encapsulants. These three types of electronic encapsulants have different appearance times, and there are also large differences in product prices and product performance. Here we mainly introduce organic silicon electronic encapsulants.
发送反馈
历史记录