The silicone adhesive described here is a one-component condensation type silicone adhesive. Its curing process requires the condensation reaction of moisture in the air. If there is a lack of moisture or too low moisture, it will lead to the condensation reaction speed. Slow down, resulting in the inability to cure according to the required time. For example, at 55% humidity, the 24H deep curing thickness is 4-5mm. Since the on-site ambient humidity is only 30%, the curing depth will not reach 4-5mm. If the thickness of the glue is required If it is 4mm, it will lead to the failure of preliminary molding.
Methyl Phenyl Silicone Oil-Products-IOTA
