Precision Engineering: Meeting Modern Industrial Demands

In the era of device miniaturization and power densification, traditional thermal interface materials struggle with high viscosity and inefficient heat transfer. IOTA 20570, a poly(methylethyl)siloxane-based low-viscosity thermal medium, achieves 4-4.5cps viscosity at 25℃ through molecular structure optimization. This represents a 60% reduction in flow resistance compared to conventional silicone oils, while maintaining 0.92-0.94g/cm³ density for uniform thermal layer formation in confined spaces.

Safety & Performance: Balancing Critical Parameters

The product demonstrates exceptional thermal stability with flash point >145℃ and pour point <-90℃, maintaining performance from -50℃ to 200℃. Electrical testing shows volume resistivity of 1×10¹⁵Ω·cm and dielectric strength exceeding 20kV/mm, making it ideal for 5G base stations and EV battery packs requiring simultaneous thermal management and electrical insulation. Chemical resistance tests confirm no degradation after 72-hour exposure to <30% sulfuric acid/hydrochloric acid solutions.

Cross-Industry Applications: Driving Technological Innovation

In semiconductor manufacturing, the product reduces die temperature by 18-22℃ when used as wafer-level thermal coating, enhancing overclocking stability. EV battery tests show 35% improvement in fast-charging thermal control efficiency. Notably, in aerospace applications, the product passed vacuum outgassing tests meeting GJB 600-1988 space-grade standards for satellite electronics encapsulation.