Molecular Innovation: Low-Viscosity Thermal Conductivity

Through end-group modification, the product achieves linear MeSi(OEt)₂-[OSiMe(OEt)]ₙ-OSiMe(OEt)₂ molecular architecture with n=1-9. This structure enables 0.68W/(m·K) thermal conductivity while maintaining low viscosity. Rheological testing shows only 8% apparent viscosity increase at 1000s⁻¹ shear rate, meeting high-speed dispensing requirements.

Performance Matrix: Industrial Medium Standards

The product passes RoHS 2.0 and REACH SVHC testing with heavy metals <1ppm. When compounded with 3% fumed silica, it achieves 1.2 thixotropic index for vertical component coating. Four-ball wear tests demonstrate 800N PB value, suitable for lifetime bearing lubrication. Photovoltaic inverter testing shows <3% medium layer thickness change after 3000 operating hours.

Cross-Disciplinary Applications: Material Science Advancements

In LED lighting, the product reduces junction temperature to <65℃ as COB-散热器 interface material, cutting lumen degradation to 3% annually. Textile applications show 40% fabric thermal conductivity improvement with 5% additive, maintaining softness. 3D printing breakthroughs include 60% internal stress reduction when used as photosensitive resin modifier.